| 摘要 |
PURPOSE:To avoid the production of a software error by covering the surface of a semiconductor chip with alpha-ray preventive film made of resin mixed with 50-80% of inorganic material refined to contain radioactive impurity element less than 1ppb in the inorganic material, thereby preventing alpha-ray from entering into the chip. CONSTITUTION:A stage 10 and outer leads 14 are formed in tapes 22. A chip 12 is mounted on the stage 10, the bonding pads of the chip are bonded to external leads 14, potting resin mixed with refined inorganic powder is potted, is heated and cured, thereby forming a film 20. Then, a casting die is contacted, molding resin is filled in the die, thereby forming a block 18, the leads 14 are cut (numeral 24 designates the cutting line), are isolated from the tape 20 as an IC unit. |
