RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more:;;wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.;

主权项

1. A resin composition for sealing an electronic device, the resin composition comprising:
(A) a polybutadiene polymer represented by the following formula (1) and having a (meth)acryloyl group at a terminal end thereof; and (B) a photopolymerization initiator,wherein the resin composition does not include a thermoplastic resin having a mass average molecular weight of 50,000 or more:wherein R1 and R2 each independently represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each independently represent a substituted or unsubstituted divalent organic group having 1 to 16 carbon atoms; R5, R6 and R7 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and at least one organic group represented by the following formula (2) is included within chemical formula (1); l and m each independently represent 0 or 1; n represents an integer from 15 to 150; and the ratio x:y is such that x:y=0 to 100:100 to 0; provided that R1 and R2 do not represent hydroxyl groups at the same time.