Low-profile chip package with modified heat spreader

摘要

An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.

主权项

1. A system, comprising:
a semiconductor die mounted on a substrate; a heat spreader that has a portion of a surface thereof thermally coupled to the semiconductor die and a cavity formed in the surface, wherein the cavity penetrates partially into the heat spreader, and wherein the portion of the surface is substantially coplanar with an opening into the cavity; and a passive device mounted on the substrate and at least partially disposed within the cavity.