| 主权项 |
1. A semiconductor module, comprising:
a printed circuit board having
an insulating plate,a first wiring layer and a fourth wiring layer disposed on a principal surface of the insulating plate,a second wiring layer and a third wiring layer disposed on a surface opposite to the principal surface,a first via disposed in the insulating plate, and electrically and mechanically connected to the first wiring layer and third wiring layer, anda second via disposed in the insulating plate, and electrically and mechanically connected to the second wiring layer and the fourth wiring layer; a first insulating substrate disposed facing the first wiring layer, and having a first circuit plate on a surface facing the first wiring layer and the fourth wiring layer; a second insulating substrate disposed facing the second wiring layer, and having a second circuit plate facing the second wiring layer and a third circuit plate facing the third wiring layer; a first semiconductor chip sandwiched between the first wiring layer and the first circuit plate, and having a conductive joining material on two surfaces to fix to the first wiring layer and the first circuit plate; a second semiconductor chip sandwiched between the second wiring layer and the second circuit plate, and having a conductive joining material on two surfaces to fix to the second wiring layer and second circuit plate; a first heat release member sandwiched and fixed between the third wiring layer and the third circuit plate; and a second heat release member sandwiched and fixed between the fourth wiring layer and the first circuit plate. |
