| 摘要 |
<p>PURPOSE:To reduce the length of a semiconductor stack by a method wherein a cooling fin is arranged and constituted in such a manner that it comes in contact with one side alone of a flat type semiconductor element. CONSTITUTION:Semiconductor elements 1a and 1b are installed on one side of the cooling fin 2 in such a manner that it can be cooled. The semiconductor elements 1a and 1b, the cooling fin 2 and an insulator 3 are assembled in a laminated manner, a clamping plate 4 is arranged, and the semiconductor stack is formed in such a manner that clamping force is applied using a locking bolt 5. The thermal loss generated at the semiconductor elements 1a and 1b by the application of a current from a power source terminal 2a is thermally conducted to the cooling fin 2, refrigerant is evaporated into vapor, the vapor is led to a condenser 7 and it is condensed there.</p> |
