发明名称 BURR REMOVING EQUIPMENT
摘要 PURPOSE:To neatly remove burrs which have been produced on the mold parts by constituting such that while semiconductor devices are being regularly turned, they are made to pass through an injecting part, and an injection material is led to uniformly collide with all the mold parts. CONSTITUTION:Injection nozzles 21... are arranged at the upper parts of conveying rollers 11... in an injecting part 6, and an injection material 22 which is fed through a pump is injected toward the rollers 11.... Then, a holding device 26 by which a multitude of semiconductor devices are held in arranged condition conveyed from the introducing part 5 in the main body 1 of the equipment to the injecting part 6. At the time, friction members 20, 20 of a rotaty mechanism 13 are resiliently brought into contact with the leading part of semiconductor devices so that they are held also by the holding member which is provided on the device 26. In accompaniment with running of the device 26, the semiconductor devices are forced to make turns through the leading part by the friction members. This constitution neatly removes burrs which have been produced on the mold parts.
申请公布号 JPS58149173(A) 申请公布日期 1983.09.05
申请号 JP19820029910 申请日期 1982.02.26
申请人 TOKYO SHIBAURA DENKI KK 发明人 NAKADA JIYUNJI
分类号 B24C3/22;B24C3/08;B24C3/32 主分类号 B24C3/22
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