| 摘要 |
PURPOSE:To prevent the generation of gap between a semiconductor chip and molded resin without increasing a process by a method wherein solid resin, with a piece of cloth with which the semiconductor chip can be sufficiently covered, is used. CONSTITUTION:A semiconductor chip 13 is mounted on the aperture part 12 of a glass epoxy resin substrate 11, and a wiring is performed using a bonding wire 14. Then a piece of cloth 15a of glass fiber, with a convexed ancillary part 15c which sufficiently covers the smiconductor chip 13, whereon a piece of solid resin formed in one body with the cloth is adhered, is placed on the semiconductor chip 13, and solid resin 15b is molded while it is being fused by heating up the substrate 11 using a hot plate. |
