| 摘要 |
An optoelectronic package, containing a semiconductor device, comprises a metal housing 1 and a transparent glass lid 4. The lid is sealed to the housing by means of a two part seal, which consists of an inner seal of a material such as epoxy resin 11 and an outer seal of solder material 10. The solder material provides a true hermetic seal to prevent ingress of contamination to the semiconductor body, whilst the epoxy material prevents fluxes given off by the soldering operation from reaching the interior of the housing. Conveniently, preforms of both solder material 10 and epoxy material 11 are carried by a common carrier 9 comprising a mesh of stainless steel Wires. The assembly is heated and compressed to cure the epoxy resin, the spacing between lid 4 and housing 1 being determined by the thickness of the solder preform. The solder is then melted to complete the seal preferably using localised heating. <IMAGE> |
