发明名称 MOUNTING ARRANGEMENTS FOR ELECTRICAL COMPONENTS
摘要 Thermal stresses which could lead to fracture of a plate 6 of boron nitride forming part of a thermally conductive electrically insulating mounting for an electrical component 1 such as a high power thyristor, are minimised by providing thin sheets 7, 8 of a material of relatively low coefficient of expansion (eg Mo or W) between plate 6 and adjacent massive bodies 4, 5 which typically are of Cu. A casing 9, 10, 11 may surround the boron nitride plate to contain an electrically insulating oil in which it is immersed. <IMAGE>
申请公布号 GB2051474(B) 申请公布日期 1984.04.26
申请号 GB19800011579 申请日期 1980.04.08
申请人 AEI SEMICONDUCTORS LTD 发明人
分类号 H01L23/373;H01L23/42;(IPC1-7):01L23/34 主分类号 H01L23/373
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