发明名称 |
Thermocurable compositions |
摘要 |
The invention relates to a thermoplastic, epoxy group-containing, urethane group-containing compound which is the product of the reaction of an epoxy resin containing more than one hydroxyl group, preferably two hydroxyl groups, and a diol which is end-masked by a diisocyanate. The compound according to the invention is preferably formed in the presence of an epoxy curing agent which is reactive at elevated temperature, and gives a 1-component material which can be used as a thermocurable adhesive or thermocurable sealant or coating composition.
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申请公布号 |
DE3315608(A1) |
申请公布日期 |
1984.05.30 |
申请号 |
DE19833315608 |
申请日期 |
1983.04.29 |
申请人 |
W.R. GRACE & CO., NEW YORK, N.Y., US |
发明人 |
LIN, SHIOW CHING, 21045 COLUMBIA, MD., US |
分类号 |
C08G18/10;C08G18/58;C08G18/69;C08G59/02;C08J5/12;C09J175/04;C23C14/06;(IPC1-7):C08G18/58;C09J3/16 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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