发明名称 Thermocurable compositions
摘要 The invention relates to a thermoplastic, epoxy group-containing, urethane group-containing compound which is the product of the reaction of an epoxy resin containing more than one hydroxyl group, preferably two hydroxyl groups, and a diol which is end-masked by a diisocyanate. The compound according to the invention is preferably formed in the presence of an epoxy curing agent which is reactive at elevated temperature, and gives a 1-component material which can be used as a thermocurable adhesive or thermocurable sealant or coating composition.
申请公布号 DE3315608(A1) 申请公布日期 1984.05.30
申请号 DE19833315608 申请日期 1983.04.29
申请人 W.R. GRACE & CO., NEW YORK, N.Y., US 发明人 LIN, SHIOW CHING, 21045 COLUMBIA, MD., US
分类号 C08G18/10;C08G18/58;C08G18/69;C08G59/02;C08J5/12;C09J175/04;C23C14/06;(IPC1-7):C08G18/58;C09J3/16 主分类号 C08G18/10
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