| 发明名称 |
Residual material detection in backdrilled stubs |
| 摘要 |
A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded. |
| 申请公布号 |
US9488690(B2) |
申请公布日期 |
2016.11.08 |
| 申请号 |
US201414462628 |
申请日期 |
2014.08.19 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Bartley Gerald K.;Becker Darryl J.;Doyle Matthew S.;Germann Philip R.;Maxson Mark O. |
| 分类号 |
G01R1/067;G01R31/28;B23Q17/20;G01R27/26;H05K3/00;H05K3/42;H05K1/02 |
主分类号 |
G01R1/067 |
| 代理机构 |
|
代理人 |
Williams Robert;Bowman Nicholas D. |
| 主权项 |
1. A method for measuring and assessing the adequacy of a backdrilling operation, the method comprising:
backdrilling a stub of a via formed in a printed circuit board to a predetermined depth; positioning a capacitance probe within the via; subsequent to the backdrilling to the predetermined depth and the positioning the capacitance probe, using the capacitance probe to obtain a test capacitance measurement; comparing the test capacitance measurement to a predetermined baseline capacitance measurement, residual conductive plating material in the backdrilled stub causing the test capacitance measurement to exceed the predetermined baseline capacitance measurement; and indicating that the test capacitance measurement exceeds the predetermined baseline capacitance measurement. |
| 地址 |
Armonk NY US |
