VACUUM DEPOSITION DEVICE

摘要

PURPOSE:To provide a titled device which decreases the resistance at a shutter part and to prevent splashing by dividing the shutter for controlling a coating weight to plural pieces and disposing the divided shutters over the entire surface in such a way that the aperture area when the shutters are fully open is approximately equal to the area of a bath. CONSTITUTION:A vacuum deposition device evaporates a plating material 5 held in a vapor deposition pan 3 by heating the same with a heater 4 in a vacuum vessel 2, and plates said material continuously on a steel strip 1 traveling through an elbow shaped channel 7 heated to the evaporating temp. of the material 5 or above by a temp. compensating heater 8 provided thereto, through an aperture 6 provided to a shutter 9. The shutter 9 in the above-mentioned device is divided to plural pieces and the divided shutters are disposed uniformly over the entire area in the flow passage for the vapor of the material 5 so that the aperture area when the shutter 9 is fully open is approximately equal to the area of the bath of the material 5. The area of the aperture 6 is made larger and the resistance of the shutter part 9 smaller by such construction and the reduction in the size of the shutter 9 is made possible.