BANHO DE COBRE SEM ELETROLISE PARA A DEPOSICAO DE COBRE SOBRE UM SUBSTRATO,PROCESSO PARA A DEPOSICAO DE COBRE A PARTIR DE UM BANHO DE COBRE SEM ELETROLISE SOBRE UM SUBSTRATO;ETILENODINITRILO-TETRA-2-PROPANOL

摘要

The improvement in electroless copper plating baths for the deposition of copper onto a substrate wherein ethylenedinitrilotetra-2-propanol (EDTP) is used as complexer. The low boiling contaminants of the commercially available EDTP are removed by a process which avoids the formation of oxidation by-products. The thus treated EDTP renders good and consistent results with respect to deposition rate and copper quality of the deposit.