| 摘要 |
PURPOSE:To ensure the removal of thin burr on the surfaces of lead parts formed at the outside of resin molded bodies, by forming the resin molded bodies in the vicinities of both ends of a molded part, and forcibly removing the bodies at the succeeding process. CONSTITUTION:Two runners, the first runner 10a and the second runner 10b, are provided. A resin is applied to the root ends of both lead wires 1, which are connected to a semiconductor pellet part so as to wrap the vicinities of the root ends. A resin molded part 5 is pushed by pushing bodies 14 from the upper and lower parts. Comb shaped jigs 16 are inserted in the gaps between resin molded bodies 15 and the molded part 5, and the gaps are expanded outward. Then thin resin burr formed at the outside of the molded bodies 15 is forcibly removed. |
