STRUCTURE USED FOR MANUFACTURING INTEGRATED CIRCUIT PACKAGE,申请号JP19830028626U-传众专利搜索

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发明名称	STRUCTURE USED FOR MANUFACTURING INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号	JPS59134858(U)	申请公布日期	1984.09.08
申请号	JP19830028626U	申请日期	1983.02.28
申请人		发明人
分类号	G06M1/00;G06M1/02;(IPC1-7):G06M1/00	主分类号	G06M1/00
代理机构		代理人
主权项
地址

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