发明名称 FIXATION OF WAFER
摘要 <p>PURPOSE:To enable to fix firmly to a plane jig a supporting film having a weak pressure-sensitive adhesive layer exfoliatable simply at suckingly transferring time of elements after cutting, and moreover to enable to fix a wafer enabling simply to exfoliate the film after sucking transference by a method wherein a pressure-sensitive adhesive layer having a different property from the weak pressure-sensitive layer is provided on the surface of the plane jig to be stuck with the supporting film. CONSTITUTION:One side of adhesive layers 21 and 3 is constructed of acrylic pressure- sensitive adhesives having polyacrylic ester as a chief agent, and another sie is constructed of rubber pressure-sensitive adhesives having a rubber component having a diene skeletal structure such as natural rubber as a chief agent, for example. A wafer A held stably on the surface of the adhesive layer 21 of a supporting film 2 is cut to be separated into elements in a cutting process, then the elements are sucked by applying heat from a film 22 or by pushing up the elements by a needle in a suckingly transferring process, and are transferred to a following process. When the adhesive layer 3 is extended 3' up to the side of a jig 1, it is favorable because exfoliation is not induced at the adhering interface between the layer 3 and the jig 1 when the film 2 is to be exfoliated. It is also favorable to stick in the circumference of the supporting film 2.</p>
申请公布号 JPS59177942(A) 申请公布日期 1984.10.08
申请号 JP19830053036 申请日期 1983.03.28
申请人 NITTO DENKI KOGYO KK 发明人 KURONO TATSUO;SHIGEMURA EIJI
分类号 H01L21/301;H01L21/78;(IPC1-7):H01L21/78 主分类号 H01L21/301
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