| 摘要 |
An appts. for soldering lead-less electronic circuitry onto a printed circuitry onto a printed circuit board is described. The improvement provides means to accelerate the solder flow, formed in a first soldering tank, in the same direction as the printed circuit board board is carried. A second soldering tank is positioned next to the first tank, and can form a reverse flow of solder to the solder flow in the first tank. The accelerating mechnism may comprise a rotary shaft having recesses that immersed in the first tank.
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