发明名称 FORMATION OF THIN METALLIC FILM
摘要 PURPOSE:To eliminate the need for intricate pretreatment and the control of working environment and to form a thin metallic film having good quality by forming successively two layers contg. respectively a noble metal element and a ferrous element on the surface of a base body in a vacuum or inert gaseous atmosphere then plating the 3rd layer on the same or resembling metal as to the element of the 2nd layer or the alloy thereof by a wet process. CONSTITUTION:A thermoplastic base body 1 which is molded and cleaned is installed in the bell-jar of a vacuum device and thereafter the inside of the bell-jar is evacuated to a prescribed degree of vacuum and gaseous Ar is introduced to a specific degree of vacuum. While the degree of vacuum is maintained, platinum is deposited thereon by a sputtering method using the high frequency of the conventional method in combination to form the 1st layer 2 having 100Angstrom thickness on the surface of the body 1. The inside of the bell-jar is then maintained at the above-mentioned degree of vacuum or below and the 2nd layer 3 of SUS-316 having 1,500Angstrom thickness is laminated and formed on the layer 2 by an ion plating method. The base body 1 is thereafter installed in a preliminarily prepd. sulfamic acid Ni bath and is plated at a prescribed current density to form the 3rd layer 4 having 0.2mm. thickness, by which good thin metallic film is formed.
申请公布号 JPS59190382(A) 申请公布日期 1984.10.29
申请号 JP19830063677 申请日期 1983.04.13
申请人 TOSHIBA KK 发明人 TAKASHIMA SEIKICHI
分类号 C23C14/06;C23C14/00;C25D1/04 主分类号 C23C14/06
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