发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To control the magnetic field intensity distribution of a target surface and to perform stable sputtering of an oxide, sulfide, etc. in a sputtering device which uses the oxide and sulfide for a target by providing plural pairs of specifically constructed magnetic poles near the target. CONSTITUTION:Many permanent magnets 2-9 are attached to the cathode part of a sputtering device on which a target is placed by connecting 2 and 9, 3 and 8, 4 and 7, 5 and 6 via another permanent magnet 1 and attaching the same to both ends of respective yokes 10, thereby forming a magnetic circuit. Coils 17 are wound via insulating materials 13, 14 on the yoke 10 and the magnitude and direction of the current to be conducted to the coils are changed to control the intensity distribution of the magnetic field (arrows I , II) on the surface of a target 20 attached to the cathode. An insulator such as an oxide, sulfide, or the like is stably sputtered even under the low gaseous pressure by such control of the magnetic field, by which the sputtering is accomplished with a uniform electro-optical characteristic distribution and film thickness distribution.
申请公布号 JPS59208072(A) 申请公布日期 1984.11.26
申请号 JP19830083840 申请日期 1983.05.12
申请人 MATSUSHITA DENKI SANGYO KK 发明人 TOUDA TAKAO;MATSUOKA TOMIZOU;FUJITA YOUSUKE;NISHIKAWA MASAHIRO;KUWATA JIYUN;ABE ATSUSHI;NITSUTA KOUJI
分类号 C23C14/36;C23C14/35;H01J37/34;H01L21/31 主分类号 C23C14/36
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