| 摘要 |
PURPOSE:To enclose an LSI having multiple pins without shortening the space between contact parts and without increasing the area of a package, by providing contact parts on both surfaces of the package wherein a semiconductor element is enclosed. CONSTITUTION:A package 11 is constituted by a ceramic package body 12, which has a recess wherein an LSI is provided, and a cap 13, which is coupled in the body 12 and seals the LSI in an airtight manner. At the peripheral parts of the upper and lower surfaces of the package 11, pins 14a and 14b, which connect the LSI that is enclosed in the package 11 to the outside, are protruded. |
