RESIN SEALED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To improve the moisture proof of the titled device by a method wherein a suspended lead is extruded outward from the surface of a package within the maximum external dimension of a resin package and the internal side of the suspended lead is vertically held at a flat type recess of the package to cut off the external side. CONSTITUTION:A recess 20 is provided on a short side of a package 12 at the edge of a suspended lead 11 connecting to an island 14 to extrude the edge of the suspended lead 11 provided that the edge will not extrude from the maximum external dimension L. In case of cutting off the suspended lead 11, the internal side of the edge 31 of the suspended lead 11 is vertically held by a metal die 56 inside the recess 20 of the package 12 to cut off the outside of said suspended lead 11 by a cutter 15. Through these procedures, no gap may be made between the suspended lead 11 and resin package 12 at all remarkably improving the moisture proof of the device.