| 发明名称 |
HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME |
| 摘要 |
A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal interface material layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper, and the density of the first carbon nanotube paper ranges from about 0.3 g/cm3 to about 1.4 g/cm3. An electronic device applying the heat-dissipation structure is also disclosed. |
| 申请公布号 |
US2016372238(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615252730 |
申请日期 |
2016.08.31 |
| 申请人 |
Tsinghua University ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
ZHANG Ling;LIU Chang-Hong;FAN Shou-Shan |
| 分类号 |
H01B11/18;H01B7/42;F28F21/02;H01L23/373 |
主分类号 |
H01B11/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat-dissipation structure comprising:
a carbon nanotube layer comprising a carbon nanotube paper comprising a plurality of carbon nanotubes, the plurality of carbon nanotubes are parallel to each other, and a density of the carbon nanotube paper ranges from about 0.3 g/cm3 to about 1.4 g/cm3. |
| 地址 |
Beijing CN |
