| 摘要 |
PURPOSE:To obtain the title device of high reliability, with an optical fiber fixed by penetration through inside and outside the package, and of excellent hermetical property by a method wherein the optical fiber is hermetically adhered to the package with solder. CONSTITUTION:A sub-mount 5 with a chip 6 fixed thereon is fixed via solder on the pedestal 4 of a stem 2 with fiber guides 10 and 11 installed with Ag solders 12 and 13, and the upper electrode provided on the chip 6 is connected to the inner end of a lead 27 by means of a wire 28. Next, the optical fiber 7 and a monitor fiber 28 covered with metallic films made of Cr and Ni layers previously at fixed sections are inserted to the two fiber guides 10 and 11, and then fixed thereto with fixing members 14 and 15 by utilizing the metallic films. Then, after a cap 3 is superposed on a ring-form sealing wall 1, the cap 3 is hermetically fixed to the stem 2 by seam welding. |
