THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER

摘要

A heat spreader provided having: as ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and as heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

主权项

1. A heat spreader, comprising:
a substrate; a metallization layer structure disposed on at least one surface of the substrate, comprising:
a thick film layer disposed on the at least one surface of the substrate;diffusion barrier layer on, and in direct contact with the thick film layer;a heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer,wherein the diffusion hairier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.