Copper clad laminate for printed circuit

摘要

Metal clad laminate comprises an interacted coupling agent layer (16) bonded to the surface of a substrate (17) and a layer (13) of ultra-thin copper connected to the coupling layer (16) by a composite bonding layer (14). The bonding layer (14) is free of copper oxide and comprises regions of copper alloyed with a second metal and oxide of the second metal.