| 摘要 |
PURPOSE:The titled composition free from corona discharge due to poor impregnation and excellent in infiltrability into min spaces of an electronic part, comprising an epoxy resin, an acid anhydride curing agent, hydrated alumina of a specified particle diameter and a red phosphorus powder of a specified particle diameter. CONSTITUTION:100pts.wt. epoxy resin is mixed with 50-200pts.wt. acid anhydride curing agent (e.g., phthalic anhydride), 10-350pts.wt. hydrated alumina having a content of particles of a particle diameter of at most 5mum<=22%, a content of particles of a particle diameter of at least 15mum<=20%, and an average particle diameter of 7-10mum, 1-100pts.wt. red phosphorus powder of an average particle diameter of 0.1-100mum and, optionally, 0.001-20pts.wt. cure accelerator (e.g., benzyldimethylamine), an inorganic filler (e.g., talc), and 0.05- 1.0pt.wt. antisetting agent (e.g., finely divided clay). |
