发明名称 PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To reduce the earth inductance in high frequency by a method wherein the width of metal strip, both ends of which will be used as earth leads, is formed equal or wider to the width of the center part. CONSTITUTION:IC chip 34 has a ceramic cap 35 to be used for resin sealing, and the lead 33 other than the earth terminal is connected to a ceramic 32. The width LA of the metal block for earthing is to be at least as wide as the width of the center part, and even when both ends alone are earthed, sufficiently small earth inductance can be accomplished, and almost no deterioration in high frequency characteristics is generated. The whole back side surface of the metal block 31 for earthing can be earthed easily, and the earth inductance can be made smaller. The metal block 31 for earthing is useful as a heat radiating material.
申请公布号 JPS60142546(A) 申请公布日期 1985.07.27
申请号 JP19830246802 申请日期 1983.12.29
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 NANBU SHIYUUTAROU;KANAZAWA KUNIHIKO;NISHIUMA MASAHIRO;KATSU SHINICHI
分类号 H01L23/50;H01L23/66 主分类号 H01L23/50
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