发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:The titled composition, obtained by reacting a polysulfone resin with epichlorohydrin, and incorporating the resultant thermosetting polysulfone resin with an epoxy resin and a curing agent, and having high heat and impact resistance and improved solvent resistance. CONSTITUTION:An epoxy resin composition obtained by reacting a polysulfone resin expressed by the formula (A is bifunctional aromatic group; n is an integer >=2) with epichlorohydrin at <1.0 ratio between OH and Cl in the presence of an alkali to give a thermosetting polysulfone resin, incorporating the resin with a polyfunctional epoxy resin, e.g. N,N,N',N'-tetraglycidyldiaminodiphenylmethane, and an epoxy resin curing agent, e.g. 4,4'-diaminodiphenyl sulfone. EFFECT:The composition has storage stability and operation stability at room temperature, and is suitable to an epoxy resin composition for prepreg.
申请公布号 JPS60156716(A) 申请公布日期 1985.08.16
申请号 JP19840012504 申请日期 1984.01.26
申请人 MITSUBISHI RAYON KK 发明人 KAKE AKIRA;TADA TAKASHI
分类号 C08G59/00;C08G59/20;C08G59/30;C08J3/24;C08L63/00 主分类号 C08G59/00
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