| 摘要 |
PURPOSE:To increase the treating capacity per unit area by sealing a plurality of electronic parts in the state laminated in a lengthwise direction. CONSTITUTION:A plurality of sealing plates 2-4 are superposed, a plurality of (e.g., 2) of leadless diodes 1 of materials to be sealed are supplied in the laminated state in a hole 5. Then, the plates 2, 3, 4 are separated by a projecting jig 6 having a plurality of projecting pins 7a, 7b having different length matched to the number of plates to be sealed, and a load is applied by a weight pin 8 from above the two diodes 1. Thus, the diodes 1 associated for sealing are fed into the sealing furnace together with a sealing jig, heated at the prescribed temperature, then cooled, fusion-bonded to the side of the material with the glass material of glass sleeve and sealed. |
