发明名称 |
METHOD FOR MANUFACTURING EPITAXIAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an epitaxial wafer capable of both suppressing occurrence of a defect in the epitaxial wafer layer and achieving high gettering ability which can getter even a metal impurity with a low diffusion rate and low concentration.SOLUTION: A method for manufacturing an epitaxial wafer for forming an epitaxial layer in a surface layer of a silicon wafer includes the steps of: implanting ions into the silicon wafer; recovering crystallinity of the surface layer of the silicon wafer implanted with the ions by subjecting the silicon wafer to flash lamp anneal treatment; and forming an epitaxial layer on the surface layer in which crystallinity of the silicon wafer is recovered.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016189435(A) |
申请公布日期 |
2016.11.04 |
申请号 |
JP20150069688 |
申请日期 |
2015.03.30 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
MIZUSAWA YASUSHI;EBARA KOJI |
分类号 |
H01L21/322;H01L21/20;H01L21/26 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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