发明名称 METHOD FOR MANUFACTURING EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an epitaxial wafer capable of both suppressing occurrence of a defect in the epitaxial wafer layer and achieving high gettering ability which can getter even a metal impurity with a low diffusion rate and low concentration.SOLUTION: A method for manufacturing an epitaxial wafer for forming an epitaxial layer in a surface layer of a silicon wafer includes the steps of: implanting ions into the silicon wafer; recovering crystallinity of the surface layer of the silicon wafer implanted with the ions by subjecting the silicon wafer to flash lamp anneal treatment; and forming an epitaxial layer on the surface layer in which crystallinity of the silicon wafer is recovered.SELECTED DRAWING: Figure 1
申请公布号 JP2016189435(A) 申请公布日期 2016.11.04
申请号 JP20150069688 申请日期 2015.03.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 MIZUSAWA YASUSHI;EBARA KOJI
分类号 H01L21/322;H01L21/20;H01L21/26 主分类号 H01L21/322
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