| 摘要 |
A high density interconnect system is described which comprises a laminated board including a conductive power plane and a ground plane insulated from each other and containing a series of holes therethrough. Signal contacts, ground contacts, power contacts, data bus interconnect contacts, and feed-through contacts are selectively mounted in the series of holes with the ground contacts and power contacts connected to the respective ground plane and conductive power plane and the other contacts insulated therefrom. Front contact housings are secured against the laminated board means and contain spring-loaded contacts in openings therein for electrical engagement with the signal contacts and for electrical engagement with pins of a signature board. Rear contact housings house contact sections of the signal, power, ground, and data bus interconnect contacts to which input/output connectors of computer boards are connected for supplying power thereto, and operating signals from the computer boards are transmitted via the signal contacts to the signature board which conducts tests on the board under test to test the same. A cam-operative apparatus moves a platen carrying the signature board so that the pins of the signature board are moved into electrical engagement with the spring-loaded contacts. |
