Arrangement for heat dissipation in the case of apparatus inserts for telecommunications technology

摘要

In order to improve the heat dissipation in the apparatus inserts (2) having a high power loss which are arranged in narrow frameworks used in telecommunications technology, the side walls (4) which are connected to the front wall (3) of the insert (2) are equipped on their insides with cooling attachments (8), and carry the heat-generating components (5) on their outsides. <IMAGE>