| 摘要 |
PURPOSE:To make uniform the thickness of sealing resin layer for the entire part of surface of panel by erecting bank materials as the resin stopper with predetermined interval along the circumference of insulated substrate, dropping sealing resin uniformly onto the surface of insulated substrate and hardening it. CONSTITUTION:The band materials 5 on a thin plate as the resin stopper are erected with predetermined interval at the circumference of a ceramic substrate 1. The bank materials 5 are formed simultaneously when the ceramic substrate 1 is manufactured by sintering. Many light emitting diode chips 2 are covered by dropping sealing resin onto the surface of ceramic substrate 1, and the sealing resin is hardened to form the sealing resin layer 4. |
