| 摘要 |
PROBLEM TO BE SOLVED: To achieve thinning of the wiring and enhancement of the connection reliability of an LED package in which the wiring connecting the electrode of an LED element and the electrode of a mounting member is formed by a droplet ejection method.SOLUTION: The element mounting recess 12 in a mounting member 11 is filled with a transparent insulating resin 16 on the periphery of an LED element 13, and a wiring path connecting an electrode 14 on the upper surface of the LED element 13 and an electrode 15 on the upper surface of the mounting member 11 is flattened by the insulating resin 16. After forming a linear or strip pattern of a liquid-repellent primer resin layer 20 by injecting a liquid-repellent primer resin ink onto the insulating resin 16 by a droplet ejection method, conductive ink is ejected onto the primer resin layer 20 by the droplet ejection method, and a pattern of wiring 17 is formed on the primer resin layer 20 across the electrode 14 on the upper surface of the LED element 13 and the electrode 15 on the upper surface of the mounting member 11. Thereafter, the electrode 14 on the upper surface of the LED element 13 and the electrode 15 on the upper surface of the mounting member 11 are connected by the wiring 17. |
