发明名称 BONDING DEVICE
摘要 PURPOSE:To enhance the reliability of a wire bonding by a method wherein the part to be wire-bonded is cleaned using ionized gas before a bonding process is performed. CONSTITUTION:Before the bonding pad on a pellet 30 and a bonding part 23 are connected by a wire bonding, the bonding part 23 is cleaned. A cleaning unit 40 consists of a gas source 411, a pressure controlling mechanism 412, a flow meter 413, a valve 414, and a power source 44. Argon gas is fed into a cleaning chamber 42 from the cleaning unit 40 through an arm 41. On the other hand, voltage is applied between an electrode 43 and the bonding part 23, and electricity is discharged. Said argon gas is ionized by the discharge, and argon ions are collided with the bonding part, hereby enabling to clean the bonding part.
申请公布号 JPS61101040(A) 申请公布日期 1986.05.19
申请号 JP19840222098 申请日期 1984.10.24
申请人 HITACHI LTD 发明人 OKAMOTO MICHIO
分类号 H01L21/60 主分类号 H01L21/60
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