发明名称 WAFER ALIGNMENT MARK
摘要 PURPOSE:To facilitate the mask alignment, by constructing alignment marks such that a portion in a mark region or background region provided with a polysilicon layer is composed of first and second sections having different total thicknesses, with the difference being such that their reflectivity cycles are deviated from each other when monochromatic light is applied thereto. CONSTITUTION:A PSG layer is took as an example to be etched. The graph shows the relation between a thickness of the PSG layer and a reflectivity of mark portions 12R and 12L, taking the thicknesses on the axis of abscissa and the reflectivities on the axis of ordinate. The graph is made by computer simulation on the assumption that the thickness of a resist layer is 9500Angstrom and the wavelength is of G line of mercury (4358Angstrom ). If the difference in total thickness between the layers in the first mark section 12R and the layers in the second mark section 12L is approximately 900Angstrom , the phases of reflectivity on the G line of mercury are deviated from each other by a half wave-length.
申请公布号 JPS61154127(A) 申请公布日期 1986.07.12
申请号 JP19840273785 申请日期 1984.12.27
申请人 OKI ELECTRIC IND CO LTD;MIYAZAKI OKI DENKI KK 发明人 NISHIMURO SUNAO;FUNATSU HIROYUKI;TAGUCHI TAKASHI;MITSUTOMI HISAMITSU
分类号 G03F9/00;H01L21/027;H01L21/30 主分类号 G03F9/00
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