VIA FORMATION USING SIDEWALL IMAGE TRANFER PROCESS TO DEFINE LATERAL DIMENSION

摘要

A method of forming a via to an underlying layer of a semiconductor device is provided. The method may include forming a pillar over the underlying layer using a sidewall image transfer process. A dielectric layer is formed over the pillar and the underlying layer; and a via mask patterned over the dielectric layer, the via mask having a mask opening at least partially overlapping the pillar. A via opening is etched in the dielectric layer using the via mask, the mask opening defining a first lateral dimension of the via opening in a first direction and the pillar defining a second lateral dimension of the via opening in a second direction different than the first direction. The via opening is filled with a conductor to form the via. A semiconductor device and via structure are also provided.

主权项

1. A semiconductor device, comprising:
a via including:
an elongated conductive body extending through a dielectric layer to an underlying layer; anda pillar on the underlying layer abutting the elongated conductive body to define a lateral dimension of the elongated conductive body.