| 摘要 |
PURPOSE:A resin composition for sealing semiconductors which is excellent in moldability and can give efficiently a molding excellent in moisture and heat resistances, obtained by mixing a phenol novolak epoxy resin with an o-cresol novolak resin as a curing agent. CONSTITUTION:A phenol novolak epoxy resin (A) having an average structure represented by formula I (wherein m is 0-10) is mixed with an o-cresol novolak resin (B), as a curing agent, having an average structure represented by formula II (wherein n is 0-10) so that the molar ratio of the epoxy groups of component A to the phenolic hydroxyl groups of component B may be 0.5-4. The obtained mixture is used as a base to obtain the purpose epoxy resin composition for sealing semiconductors. As component A, a resin having a hydrolyzable chlorine content <=1,500ppm, a free chlorine content <=10ppm and a free sodium content <=10ppm is preferable. |
