Semiconductor package and fabrication method thereof

摘要

A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a semiconductor structure having a carrier, a circuit portion formed on the carrier and a plurality of semiconductor elements disposed on the circuit portion; disposing a lamination member on the semiconductor elements; forming an insulating layer on the circuit portion for encapsulating the semiconductor elements; and removing the carrier. The lamination member increases the strength between adjacent semiconductor elements so as to overcome the conventional cracking problem caused by a CTE mismatch between the semiconductor elements and the insulating layer when the carrier is removed.

主权项

1. A semiconductor package, comprising:
a circuit portion having opposite first and second sides; a plurality of semiconductor chips disposed on the first side of the circuit portion; a lamination member disposed on the semiconductor chips so as to increase a strength between the semiconductor chips, wherein the lamination member is a dummy die; and an insulating layer formed on the first side of the circuit portion for encapsulating the semiconductor chips.