发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:A radiation-curable resin composition excellent in thermal cycling resistance and heat resistance, comprising an unsaturated alicyclic epoxy compound, a specified (meth)acrylate resin, a polymerizable vinyl monomer and a photopolymerization initiator CONSTITUTION:5-95pts.wt. unsaturated alicyclic epoxy ester compound obtained by reacting an alicyclic epoxy compound of formula I with 0.5-1.1 equivalent, per equivalent of the epoxy groups, of (meth)acrylic acid is mixed with 95-5pts. wt. (meth)acrylate resin of formula III (wherein R1-3 are each H, formula IV or formula V except the case where all of them are H) obtained by reacting (meth)acrylic acid with a lactone-modified tris(2-hydroxy) isocyanurate of formu la II (wherein n1-3 are each 0-10 and must not be 0 at the same time) obtained by ring-opening polyaddition of tris(2-hydroxyethyl) isocyanurate with epsilon- caprolactone, 0-90pts.wt. polymerizable vinyl monomer such as a (meth)acrylate and 0.1-10pts.wt. photopolymerization initiator such as benzoin.
申请公布号 JPS61207419(A) 申请公布日期 1986.09.13
申请号 JP19850047506 申请日期 1985.03.12
申请人 DAICEL CHEM IND LTD 发明人 FUNATO SUSUMU;WATANABE MASAHARU;MURAI TAKAAKI
分类号 C08G59/00;C08F2/48;C08F290/00;C08F299/00;C08F299/02;C08F299/04;C08G59/17;C09D5/00 主分类号 C08G59/00
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