发明名称 RESIN SEALING MOLD
摘要 PURPOSE:To facilitate cleaning work, by providing resin sealing projection parts in the vicinity of parts, which push a leadframe, in a mold, so that the projection parts can be protruded and accommodated. CONSTITUTION:Resin sealing projection parts 4 and 4 are energized by springs 8 toward the facing forces and provided so that the parts are protruded and accommodated at the outsides of parts 9 of top and bottom forces 2a and 2'a, which push a leadframe. When the mold is cleaned, the leadframe is not present between the top and bottom forces 2a and 2'a. Therefore, the projection parts 4 and 4 are protruded by the spring action and contacted with the end surfaces of the facing forces 2a and 2'a. Recess parts 9a and 9a, which are communicated to cavities 2b and 2'b, are formed, by two projection parts 4 and 4 including parts 9 of the upper and lower forces of the upper and lower forces 2a and 2a', which push the leadframe. The recess parts 9a are shielded from the outside by the projection parts 4 and 4. Thus a cleaning resin 5 does not leak to the outside.
申请公布号 JPS61234536(A) 申请公布日期 1986.10.18
申请号 JP19850077183 申请日期 1985.04.11
申请人 NEC CORP 发明人 KOBAYASHI YASUHISA
分类号 H01L21/56;B29C33/00;B29C33/72;B29C45/02;B29C45/14;B29C45/26;B29K101/10;B29L31/34 主分类号 H01L21/56
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