发明名称 MANUFACTURE OF METALLIZING LAMINATED FILM
摘要 <p>PURPOSE:To prevent a crack from generating in an evaporated film, which is used as the metallizing laminated film, and to prevent a drop in the adhesive strength of the evaporated film with a film to be evaporated by a method wherein an olefin resin is extruded from an extruder die at a specific temperature and is formed in a fused thin film, and after the fused thin film is ozonated, the thin film is pressure adhesion-laminated on the metallized film. CONSTITUTION:When this metallizing laminated film is manufactured by extrusion-laminating the olefin resin on the metallized film, the olefin resin is extruded from the extruder die at a resin temperature of 150-290 deg.C and is formed in a fused thin film, then after the fused thin film is ozonated, the thin film is pressure adhesion-laminated on the metallized film. When the temperature of the resin, which is extruded from the extruder die, is 150 deg.C or less, the spreading properties of the resin is degraded, the fused thin film can not be obtained smoothly and the adhesive strength of the evaporated film with the metallized film becomes insufficient. When the temperature of the resin exceeds 290 deg.C, a crack generates in the evaporated film, which is used as the metallizing laminated film, and a remarked drop in the adhesive strength of the evaporated film with the film to be evaporated generates.</p>
申请公布号 JPS61283533(A) 申请公布日期 1986.12.13
申请号 JP19850125486 申请日期 1985.06.10
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 ISHIZAKI YOSHIHIRO;MATSUMOTO AKIHIRO;YAMASHITA TAKASHI
分类号 C23C14/20;B29C65/02;B29C69/00;B29K23/00;B29L9/00;B32B15/08;B32B15/085;B32B37/00 主分类号 C23C14/20
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