| 摘要 |
PURPOSE:To halve number of bonding pads and to increase the area by connecting a common bonding pad to a head element selected from the 1st and 2nd head elements formed on a common head base together via a connection conductor. CONSTITUTION:The 1st and 2nd magnetic heads HE1, HE2 and the common bonding pads Pa, Pb are formed on the head base M. In this case, the 1st and 2nd head elements HE1, HE2 and the common bonding pads BPa, BPb and one head element (HE1 or HE2) selected from the 1st and 2nd head elements HE1, HE2 and the bonding pads BPa, BPb are connected together via connection conductors La1, Lb1 or La2, Lb2. Thus, the number of bonding pads is halved and the area is increased. |
