| 摘要 |
PURPOSE:To improve the reliability of connecting a semiconductor region to wiring by a method wherein a semiconductor region and the first wiring layer on it, the first wiring layer and the second wiring layer on it are provided, and they are connected through plural connection holes so that the connection holes are not overlapped. CONSTITUTION:A connection hole 13 and a connection hole 15 are arranged substantialy on one line and provided one after another. Thus, the width of a conductive layer 11 at the upper part of a semiconductor region 6 is reduced, improving the degree of integrity of a semiconductor integrated circuit device, Moreover, the conductive layers 11 and 15 are connected electrically favorable, with improved electrical reliability of a semiconductor integrated circuit device.
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