发明名称 CAPILLARY TIP FOR WIRE BONDING
摘要 PURPOSE:To increase the reliability in wire bonding and to make it high speeding by providing an uneven part on the pressure face of the fine metallic wire of a capillary tip. CONSTITUTION:A fine metallic wire 5 is fed from a through hole 4 by forming a bonding pad 2 on the surface of the insulating substrate 1 of a hard glass, etc. and by arranging a capillary tip 3 on the upper part thereof. Plural small holes 7 are formed on the concentric circle of the pressure face 6 of the fine metallic wire of the tip 3. The pressure face 6 deforms the fine wire 5 with its squash with the descent of the tip 3 and by this bite the frictional force between the pressure face 6 and fine wire 5 is strengthened. The ultrasonic vibration of the tip 3 therefore forms a clean crystal face contact via the frictional vibration of the pad 2 and fine wire 5. Consequently, the pad 2 and the metallic wire 5 are surely adhered by the local heating and the reliability increase and high speeding in wire bonding are enabled.
申请公布号 JPS6224878(A) 申请公布日期 1987.02.02
申请号 JP19850161779 申请日期 1985.07.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAITO TOSHIJI
分类号 B23K20/00;B23K20/10 主分类号 B23K20/00
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