| 摘要 |
PURPOSE:To prevent short-circuit due to the creeping-up of an electrically adhesive as well as to improve the adhesive strength by providing a recessed portion in a place on the upper surface of the mount lead portion in which a semiconductor device is to be set, and providing the sides of this recessed portion with grooves communicating with this recessed portion. CONSTITUTION:In a stem main body 11 a mount lead portion 12 is provided so as to pass through upwardly and downwardly, the upper portion of the mount lead portion 12 is provided with a recessed portion (emboss) 13 for mounting a light emitting diode, and grooves 14 are provided communicating with the emboss 13. A III-V compound semiconductor device (light emitting diode) 17 is mounted in the recessed portion 13 of the lead portion 12 through an electrically conductive adhesive layer 16. With this, since the electrically conductive adhesive layer 16 flows into the grooves 14 when mounting the lighe emitting diode 17, it does not creep up the sides of the light emitting diode 17, thereby preventing short-circuit at a PN junction 18. |
