| 摘要 |
PURPOSE:To extend the life of a chemical copper plating liquid by dissolving a copper oxide or copper hydroxide into a complexing agent soln. of copper ions and filtering away the undissolved components then adding the soln. to the chemical copper plating liquid thereby replenishing the copper ions. CONSTITUTION:The copper oxide or copper hydroxide is dissolved in the complexing agent soln. of the copper ions and after the undissolved components are removed thereform by the filtration, etc., the soln. is added to the chemical copper plating liquid in a method for repeatedly executing chemical copper plating by replenishing the copper ions to the chemical copper plating liquid contg. the copper ions, complexing agent and reducing agent. The concn. of the copper ions in the copper ion replenishing liquid is preferably made equivalent to the concn. of the complexing agent therein. The chemical copper plating liquid contg. the copper ions, complexing agent, reducing agent, etc. can be used as the complexing agent soln. for the above-mentioned copper ions and in this stage, the copper oxide, etc., are preferably dissolved after the removal of the reducing agent or the dissolved in an air oxidative atmosphere to prevent the deposition of the copper. |
