| 摘要 |
PURPOSE:To omit a wire bonding process for the reduction of loss and for the improvement in reliability by a method wherein a metal bonding pad is formed on the side or upper surface of a chip. CONSTITUTION:The side or upper surface of a semiconductor chip 20 facing the same of a neighboring semiconductor chip 20 is provided with a metal pad 15. The metal pad 15 is built of a low-melting metal or its low-melting alloy, whereto a wiring is to be bonded. The metal pad 15 thus formed is irradiated with a laser beam 16 and is melted. Two tiny metal pads 15 after exposure to heat develop into a metal pad 17 and connect two metal wirings 12 on substrates 11 belonging to the two semiconductor chips 20. In this way, high- reliability connection is established with but a little loss in a short period of time.
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