发明名称 SEALED ELECTRONIC DEVICE
摘要 PURPOSE:To prevent yielding of blowholes and to improve packaging reliability, by constituting a sealing part, in which a bonding material is provided between the base part of a sealing body and a cap part, so that the thickness of the bonding material becomes partially narrow. CONSTITUTION:A low-melting point glass 5 is applied and printed along the periphery of the surface of a topmost layer 9 on the side of a base in a loop shape. The glass 5 is contacted with a protruded part 8, and a cap 2 is positioned here. This part is heated, and the glass at the outside of the protruded part 8 is fused. Thus the cap 2 and the base 1 are sealed. Expanded gas is yielded in a cavity 4 due to heating when a ceramic package is assembled and sealed. when said gas is going to enter a sealing part, the yield of blowholes is prevented by the protruded part 8. Or the yield of the blowholes is prevented by the decrease in thickness of a bonding material and the increase in surface tension of a material to be bonded.
申请公布号 JPS62149155(A) 申请公布日期 1987.07.03
申请号 JP19860048402 申请日期 1986.03.07
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 YAMADA TOMIO;HOSHI AKIRO;YAMAZAKI KAZUO;KAGII HIDEMASA
分类号 H01L23/02;H01L23/10 主分类号 H01L23/02
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