| 摘要 |
PURPOSE:To prevent the deformation of a pattern shape due to thermosetting at a base part caused by temperature increase when evaporated metal is formed, by using an imide resin at the base part for an air bridge. CONSTITUTION:In forming processes of an air bridge pattern, the shape and the height of a base part for the air bridge are stably provided. An imide resin 6 is used in place of photoresist at the base part for the air bridge so that the resin can be readily dissolved even if the temperature of a substrate 1 is increased when evaporated metal 4 is formed. Since the base part for the air bridge is formed with the imide resin 6, the pattern shape is not deformed even if the heat resistance of the imide resin 6 is increased to the temperature of 200 deg.C by adding a curing process. The resin is readily dissolved in the treatment with a releasing liquid.
|
